For more information on the Chip2Foil project please contact the coordinator: Dr. Marcel Tichem, m.tichem@tudelft.nl.

This project is supported by

FP7

the EU

Technology for low cost production of communicative foils

The Chip2Foil project aims at realising a technology platform for low cost placement and interconnection of ultra thin chips on polymer foils, within a high volume, reel-to-reel production concept. This competence is necessary to realise the communicative packages against cost requirements. Communicative packages provide increased interaction between the packed product, the package and the user through near-field communication systems. The application focused on in the Chip2Foil project is a Smart Blister package, which monitors the medicine taking behaviour of patients to ensure therapy compliance.

The technical concept proposed in the Chip2Foil project combines two main elements: (1) self-assembly for high speed ultra thin chip placement with moderate accuracy, and (2) an adaptive circuitry approach, which compensates the initial placement errors and creates electrical interconnects after the chips have been placed. This approach is expected to result in high throughput and low cost manufacturing of foil-based packages.

moreLatest news and events

Qolpac winner of "2012 Contactless and Mobile Award"

Qolpac, the end-user partner in the Chip2Foil consortium, is the winner of one of the 2012 Contactless and Mobile Awards. Qolpac received the award in...

 

Qolpac presents at the MIT Enterprise Forum Cambridge

Qolpac presents its view and approach at the MIT Enterprise Forum Cambridge on NFC in Smartphones Transfroms Healthcare. The event was visited by 300+...

 

Conference announcement ECTS2012

On Sept 17-20, 2012, the 4th Electronics System Integration Conference (ECTS) will be held in Amsterdam. For more information visit the conference...