For more information on the Chip2Foil project please contact the coordinator: Dr. Marcel Tichem, m.tichem@tudelft.nl.

This project is supported by

FP7

the EU

Technology for low cost production of communicative foils

The Chip2Foil project aims at realising a technology platform for low cost placement and interconnection of ultra thin chips on polymer foils, within a high volume, reel-to-reel production concept. This competence is necessary to realise the communicative packages against cost requirements. Communicative packages provide increased interaction between the packed product, the package and the user through near-field communication systems. The application focused on in the Chip2Foil project is a Smart Blister package, which monitors the medicine taking behaviour of patients to ensure therapy compliance.

The technical concept proposed in the Chip2Foil project combines two main elements: (1) self-assembly for high speed ultra thin chip placement with moderate accuracy, and (2) an adaptive circuitry approach, which compensates the initial placement errors and creates electrical interconnects after the chips have been placed. This approach is expected to result in high throughput and low cost manufacturing of foil-based packages.

moreLatest news and events

BeyonDevices and Qolpac announce collaboration

BeyonDevices and Qolpac announce collaboration to start a new era in Medicine Packaging, see their press release.

 

Join Chip2Foil on LinkedIn

Stay tuned with Chip2Foil progress, and join discussions on smart blister packages and thin chip integration. See this link.

 

Chip2Foil AIPIA press release

The AIPIA organisation has included a news itme on Chip2Foil in its newsletter, see aipia.info/news_104_low-cost-chips-for-smart-packs.php.