News and events

Chip2Foil present at TU Delft Customer Day

The Chip2Foil project will be present at the TU Delft Customer Day on November 4, 2010. The Customer Day is an initiative from the Delft Centre for Mechatronics and Microsystems (DCMM, www.dcmm.tudelft.nl), an interdisciplinary forum for research groups from Mechanical Engineering and Electrical Engineering/DIMES. During the Customer Day, about 50 research project will be presented in a technical fair-like setting, covering themes including precision motion and metrology, micro- and nanosystems and manufacturing, mobile robots and humanoids, vehicle mechatronics, and modelling & simulation.

The Customer Day is open on invitation for managers and project leaders R&D. For more information and enquiries on entrance tickets, please contact Ms. I.N. (Inge) van Marion-Rehorst.

Chip2Foil project presented at the June OLAE Concertation meeting

The 2010 Organic and Large Area Electronics Cluster/Concertation Meeting was held in Brussels on 14-15 June. More than 60 attendees, coming from both industry and academia, participated in this event and presented their latest research in organic electronics. The event brought together 34 projects, financially supported through the European Commission's 7th Framework programme, dealing with a broad spectrum of advanced research on organic electronics and applications.

All presentation are made available through the EU's CORDIS website. For more information on the meeting as well as the links to the presentations, see the link below.

7th Annual Conference on Foundations of Nanoscience (FNANO2010)

Conference on nanoscience, in particular the creation of nano-scaled structures. Self-assembly plays a key role at this scale. Date/location: April 27-30, 2010, Snowbird, Utah, USA.

EU FP7 Chip2Foil makes a start

The EU FP7 funded collaborative project Chip2Foil made its official start on January 1, 2010. The project aims to deliver ultra thin chip integration processes for low cost communicative polymer foils. Seven partners, both industry and knowledge institutes, team up to beat challenges in the assembly of ultra thin chips, with high throughput and against low cost. See the Project description for more information on the background, the targets and the work to be done.